The machine is used in drilling though holes and blind holes of FPC flexible printed circuit board,cutting cover layer ,and cutting rigid-flexible circuit.
ADVANTAGE
1.Compound beam drilling.
2.High speed and highly integrated design.
3.Customized RTR automatic loading system.
TECHNICAL PARAMETER
Specification of UV Laser Drilling Machine for Blind Holes (ASIDA JG23M)
USAGE
The machine is used in drilling though holes and blind holes of FPC flexible printed circuit board,cutting cover layer ,and cutting rigid-flexible circuit.
ADVANTAGE
1.Compound beam drilling.
2.High speed and highly integrated design.
3.Customized RTR automatic loading system.
TECHNICAL PARAMETER
Specification of UV Laser Drilling Machine for Blind Holes (ASIDA JG23M)
MODEL
ASIDA JG23M
Applications
Applied for blind holes processing
System Processing Accuracy ( ZHENGYE Conditions)
±20μm
Laser power
11W@40kHz
Laser Wavelength
355nm
Pulse width
90±30ns@40kHz
Frequency range
40-90kHz
Energy control
Yes
Differences Between Up and Down Hole Diameter
≤12.5μm
Objects
Maximum Processing Size
520mmX620mm
Table number
Single beam, single table
Dimensions (L×W×H)
1600mmx1650mmx1940mm
Weight
2300kg