The machine is used in drilling though holes and blind holes of FPC flexible printed circuit board,cutting cover layer ,and cutting rigid-flexible circuit.
ADVANTAGE
1.Compound beam drilling.
2.High speed and highly integrated design.
3.Customized RTR automatic loading system.
TECHNICAL PARAMETER
Specification of UV Laser Drilling Machine for Through Holes (ASIDA JG23T)
USAGE
The machine is used in drilling though holes and blind holes of FPC flexible printed circuit board,cutting cover layer ,and cutting rigid-flexible circuit.
ADVANTAGE
1.Compound beam drilling.
2.High speed and highly integrated design.
3.Customized RTR automatic loading system.
TECHNICAL PARAMETER
Specification of UV Laser Drilling Machine for Through Holes (ASIDA JG23T)
MODEL
ASIDA JG23T
Applications
Applied for though holes processing
System Processing Accuracy ( ZHENGYE Conditions)
±20μm
Laser power
11W@40kHz
Laser Wavelength
355nm
Pulse width
45 ns～ 60ns@40kHz
Frequency range
0 150kHz
Energy control
Yes
Differences Between Up and Down Hole Diameter
≤12.5μm
Objects
Maximum Processing Size
520mmX620mm
Table number
Single beam, single table
Dimensions (L×W×H)
1600mmx1650mmx1940mm
Weight
2300kg