Used in workshop of PCB plant for clearing impurities. Its main function is for laminated layers of laminating process, steel plate and copper foil cleaning; It is also suitable for cleaning equipment surface and table top in dust-free rooms.
FEATURES:
It does not incur any dust and no drop of gel and can thoroughly clean the dust on the surface of printed plate and copper foil so as to reduce the occurrence of defect like scratch marks and dent on the plate surface after laminating
APPLICATION:
Used in workshop of PCB plant for clearing impurities. Its main function is for laminated layers of laminating process, steel plate and copper foil cleaning; It is also suitable for cleaning equipment surface and table top in dust-free rooms.
FEATURES:
It does not incur any dust and no drop of gel and can thoroughly clean the dust on the surface of printed plate and copper foil so as to reduce the occurrence of defect like scratch marks and dent on the plate surface after laminating
SPECIFICATION:
Size
22cm×100m×4layers
type
features
type
features
Hy-881
Feel soft and fluffy with low viscosity
HY-301
Feel soft and fluffy with low viscosity
Hy-882
Feel straight with moderate viscosity
HY-302
Feel straight with moderate ciscosity
Hy-883
Feel straight with high viscosity
HY-303
Feel straight with high viscosity
Hy-884
Feel straight with high viscosity
HY-304
Feel straight with high viscosity
Hy-885
Feel straighten with high viscosity
HY-305
Feel straighten with high viscosity