Used to test solderability and heat stress for PCBs.
Characteristics • Internal container is made of special material that conforms to lead-free standards. • Patented design that adopts PID temperature adjustment unit to create stable, uniform and precise temperatures. • Time adjustment and alarm functions. • Main body and control box are separated for safety reasons. • Electrical wire has over-current protection, with easily replaceable fuse.
Usage
Used to test solderability and heat stress for PCBs.
Characteristics• Internal container is made of special material that conforms to lead-free standards.
• Patented design that adopts PID temperature adjustment unit to create stable, uniform and precise temperatures.
• Time adjustment and alarm functions.
• Main body and control box are separated for safety reasons.
• Electrical wire has over-current protection, with easily replaceable fuse.
• Conforms to flexible PCB technical manual: GB/T 4677-2002; IPC-TM-650 2.4.12-1996; IPC-TM- 650 2.4.13-1998.
Technical Parameter
Model
Item
KH23
KH33
Internal dimension
190×250×80（L×W×H）
250×420×100（L×W×H）
Shape diameter
450×380×320（L×W×H）
617×495×310（L×W×H）
Control box dimension
261×160×192（L×W×H）
Volume of soldering tin
1.90～2.53L (13.4～18.0kg)
5.2～7L（38kg～51kg）
Power requirement
AC220V 50Hz
Power
1.5kw±5%
3kw±5%
Temperature adjustment range
~300℃
Weight
35kg
45kg