The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.
ADVANTAGE
1) Two tables to cycle working one by one,no preparing time,high processing efficiency.
2) Preview function before processing to avoid damaging sample.
USAGE
The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.
ADVANTAGE
1) Two tables to cycle working one by one,no preparing time,high processing efficiency.
2) Preview function before processing to avoid damaging sample.
3) Bar code marking function.
CUTTING EXAMPLE
TECHNICAL PARAMETER
Specification of UV Laser Cutting Machine
Model
JG16C
Wavelength
355nm
Laser Power
Standard 10W，Option 15W
Laser Frequency
30-120kHz
Maximum Processing Size
650mm x 550mm
(Double platforms）
Maximum Operating Speed
800mm/s
Positioning Accuracy of Table
±3μm
Repetitive Positioning Accuracy of Table
±1μm
Total Accuracy
±20um
light spots
20±5μm
Scanning range
45mmx45mm
File Format
*.gbr & *.dxf & *.lay
Electric Power Supply
AC220V/2kW； AC380V/5.5kW
Dimensions(L x W x H)
1780mmx1610mmx1650mm
Weight
3600kg
Environmental Temperature
20±2℃
Environmental Humidity
≤60%RH, Non-condensing
Ground Amplitude
≤5μm
Ground Pressure
≥1000Kgf/m2