Mainly used in the circuit board industry, flexible board (FPC), flexible and rigid board (RF) and thin multi-layer board cutting forming.
ADVANTAGE
(1) Good effect: smooth and neat cutting surface, no burr, slight carbonation;
(2) Automation: the processing of software plate is installed on the fixture, which flows through the flow platform, automatically clamps and automatically locates the processing, without manual feeding.After processing, automatic outflow.
USAGE
Mainly used in the circuit board industry, flexible board (FPC), flexible and rigid board (RF) and thin multi-layer board cutting forming.
ADVANTAGE
(1) Good effect: smooth and neat cutting surface, no burr, slight carbonation;
(2) Automation: the processing of software plate is installed on the fixture, which flows through the flow platform, automatically clamps and automatically locates the processing, without manual feeding.After processing, automatic outflow.
TECHNICAL PARAMETER
Specifications of UV Laser Cutting Machine
Model
JG15C
Wavelength
355nm
Laser Power
Standard 15W
Laser Frequency
40-120kHz
Maximum Processing Size
200mm×270mm
Total Accuracy(Zhengye Conditions)
±50um
Motor Speed
500mm/s
Motor Positioning Accuracy
±4μm
Motor repeatability
±2μm
Cutting line width
15-28μm
Laser scanning range
40 mm x 40mm
Processing documents
*.gbr & *.dxf
Dimensions(L x W x H)
1100mm×1570mm×1700mm
Electric Power Supply
Host : AC220V 50～60Hz/1.5kW
Vacuum cleaner : AC380V 50～60Hz/1.5kW
Weight
1500kg
Environmental Temperature
20±2℃
Environmental Humidity
≤60%RH
Air cleanliness
100k